Perforated Z-profile 1000-2,5 HDZ IEK
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Main specifications
Model | Simple profile |
Length, mm | 1000 |
Material thickness, mm | 2.5 |
Surface protection | Hot-dip galvanized |
Height, mm | 100 |
Description
Perforated Z-shaped profile is designed for installation of cable carrying systems, heating, ventilation and air conditioning systems, as well as for installation of metal shells, control panels, alarm systems, lighting equipment and other electrical appliances. The peculiarity of the design of the profile is that it can be fastened both with studs onto the ceiling and on the walls or floor with anchors and dowels with posterior installation of equipment on it. Perforated Z-shaped profile has the ability to withstand numerous bendings and unbendings, maintaining its shape and physical properties. Therefore, it can be used in structures under constant dynamic loads and vibration.
Life time:
20 years
Warranty:
3 years
Advantages
- High corrosion resistance.
- The thickness of the zinc coating is not less than 55 microns.
- Ability to maintain the required level of rigidity under different operating conditions.
- Convenient perforation to speed up installation.
Specifications
Model | Simple profile |
Length, mm | 1000 |
Material thickness, mm | 2.5 |
Surface protection | Hot-dip galvanized |
Height, mm | 100 |
Width, mm | 50 |
Type of perforation | 2 sides punched |
Material quality | Other |
Profile shape | Z-profile |
Hole width, mm | 11 |
Material | Steel |
Weight, kg | 2,89 |
Size of sockets, mm | 27х11 |
Impact strength, J | 10 |
Zinc coating thickness, µm | ≥ 55 |
Corrosion resistance class in accordance with GOST R 52868 | 6 |
Ambient temperature, °C | -50...40 |
Mounting temperature, °C | -50...40 |
Documents
Passports
Software
Logistics parameters
Transport | |
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Quantity | 2 |
Units | pc; 1 |
Type of packaging | BOND |
Packaging material | POLYPROPYLENE |
Barcode | 4606056624304 |
Gross weight, kg | 5.7 |
Netto weight, kg | |
Volume, m^3 | 0.0005 |
Length, cm | 10 |
Height, cm | 5 |
Width, cm | 10 |
Method of applying information | Mold |